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METHOD OF TEACHING EYEPOINTS FOR WIRE BONDING AND RELATED SEMICONDUCTOR PROCESSING OPERATIONS
METHOD OF TEACHING EYEPOINTS FOR WIRE BONDING AND RELATED SEMICONDUCTOR PROCESSING OPERATIONS
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机译:引线键合教示点的方法及相关的半导体加工操作
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摘要
A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.
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