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Electronic packaging technique to improve sensor failure robustness
Electronic packaging technique to improve sensor failure robustness
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机译:电子封装技术可提高传感器故障的稳定性
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摘要
A modular sensor assembly comprises: sensor arrays electrically coupled to a sensor substrate; a plurality of integrated circuits with sensor signal processors electrically coupled to a package substrate; and an interconnect assembly including electrical paths configured to electrically couple analog output signals from a first sensor array to a first integrated circuit and from a second sensor to a second integrated circuit, the first sensor disposed adjacent to the second sensor.
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