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Silver-palladium alloy containing conductor paste for ceramic substrate and electric circuit

机译:含银钯合金的陶瓷基板和电路用导体浆料

摘要

A conductor paste for a ceramic substrate contains a) a conductive metal powder comprising a silver powder and a palladium powder; b) a glass powder; and c) an organic solvent, wherein the conductive metal powder has an average particle diameter of not more than 1.2 μm, and the glass powder is a Bi2O3—SiO2—B2O3 type glass powder, and the content of the glass powder is in a range of from 1 to 6 wt % based on the weight of the paste.
机译:用于陶瓷衬底的导体浆料包含:a)包含银粉和钯粉的导电金属粉;和b)玻璃粉; c)有机溶剂,其中导电金属粉末的平均粒径不大于1.2μm,且玻璃粉末为Bi 2 O 3 -SiO 2 -B 2 O 3 型玻璃粉,该玻璃粉的含量为1-6 wt%糊的重量。

著录项

  • 公开/公告号US8043536B2

    专利类型

  • 公开/公告日2011-10-25

    原文格式PDF

  • 申请/专利权人 AKIRA INABA;NAOTO NAKAJIMA;

    申请/专利号US201113014256

  • 发明设计人 NAOTO NAKAJIMA;AKIRA INABA;

    申请日2011-01-26

  • 分类号H01B1/22;B05D5/12;

  • 国家 US

  • 入库时间 2022-08-21 18:12:17

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