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ULTRASONIC PROBE, METHOD FOR MANUFACTURING THE SAME AND ULTRASONIC DIAGNOSTIC APPARATUS

机译:超声波探头,制造该超声波探头的方法和超声波诊断仪

摘要

An ultrasonic probe is provided with a CMUT chip having a plurality of transducer elements that change electromechanical coupling coefficients or sensitivities in accordance with a bias voltage to transmit and receive ultrasonic waves, an electric conducting layer formed on the ultrasonic irradiation side of the CMUT chip, an acoustic lens arranged on the ultrasonic irradiation side of the CMUT chip, an insulating layer formed in the direction opposite to the ultrasonic irradiation side of the acoustic lens, a housing unit that stores the CMUT chip in which the electric conducting layer and the insulating layer are fixed with an adhesive and the acoustic lens, wherein the insulating layer is formed by the material that includes at least either silicon oxide or paraxylene to prevent a solvent of the adhesive from soaking into the adhered portion.
机译:超声波探头具有:CMUT芯片,其具有根据偏置电压改变机电耦合系数或灵敏度以传送和接收超声波的多个换能器元件;导电层,形成在CMUT芯片的超声波照射侧,声学透镜,布置在CMUT芯片的超声辐射侧;绝缘层,形成在与声学透镜的超声辐射侧相反的方向上;容纳单元,其中容纳CMUT芯片,导电层和绝缘层绝缘层由粘合剂和声透镜固定,其中绝缘层由至少包括氧化硅或对二甲苯的材料形成,以防止粘合剂的溶剂浸入粘合部分中。

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