首页> 外国专利> MID-PLANE MOUNTED OPTICAL COMMUNICATIONS SYSTEM AND METHOD FOR PROVIDING HIGH-DENSITY MID-PLANE MOUNTING OF PARALLEL OPTICAL COMMUNICATIONS MODULES

MID-PLANE MOUNTED OPTICAL COMMUNICATIONS SYSTEM AND METHOD FOR PROVIDING HIGH-DENSITY MID-PLANE MOUNTING OF PARALLEL OPTICAL COMMUNICATIONS MODULES

机译:提供并行光学通信模块的高密度中间平面安装的中间平面安装光学通信系统和方法

摘要

An optical communications system and method are provided in which multiple parallel optical communications modules are mid-plane mounted on a PCB motherboard. Each module is connected to an optical fiber ribbon cable. The modules are configured to have very low profiles and/or to provide an angular coupling of the ribbon cable to the module. In both cases, the module configurations obviate the need to leave a significant amount of space between a module and the one behind it for the purpose of providing room for the ribbon cable to exit the module without the cable being bent beyond its minimum bend radius. This feature allows the module mounting density on the motherboard PCB to be very high and allows the modules to be mounted closer to their respective hub ICs, which increases mounting density and allows the modules to be mounted closer to their respective hub ICs.
机译:提供了一种光通信系统和方法,其中多个并行光通信模块被中平面安装在PCB母板上。每个模块都连接到光纤带状电缆。模块被配置为具有非常低的轮廓和/或提供带状电缆到模块的角度耦合。在这两种情况下,模块配置都消除了在模块与其后面的模块之间留出大量空间的需要,目的是为带状电缆提供足够的空间使带状电缆退出模块,而电缆不会弯曲超过其最小弯曲半径。此功能可以使主板PCB上的模块安装密度非常高,并且可以将模块安装在更靠近其各自的集线器IC的位置,这可以提高安装密度,并且可以将模块安装在更靠近其各自的集线器IC的位置。

著录项

  • 公开/公告号US2010303423A1

    专利类型

  • 公开/公告日2010-12-02

    原文格式PDF

  • 申请/专利权人 LAURENCE R. MCCOLLOCH;

    申请/专利号US20090474410

  • 发明设计人 LAURENCE R. MCCOLLOCH;

    申请日2009-05-29

  • 分类号G02B6/36;

  • 国家 US

  • 入库时间 2022-08-21 18:11:26

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号