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System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices
System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices
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机译:用于在封装(SIP)设备中的系统的并排芯片和引线框架之间路由电源电压或其他信号的系统和方法
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摘要
An integrated circuit or chip includes a first die and a second die positioned on a lead frame of a package including a lead frame, such as a QFP, DIP, PLCC, TSOP, or any other type of package including a lead frame. The integrated circuit further includes a redistribution layer formed on the first die to couple selected bond fingers of the lead frame to selected bonding pads of the first and second die. The selected bond fingers may correspond to bond fingers that receive a first supply voltage or the first supply voltage and a second supply voltage.
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