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Structure and method for enhancing resistance to fracture of bonding pads
Structure and method for enhancing resistance to fracture of bonding pads
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机译:增强焊盘抗断裂性的结构和方法
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摘要
The present invention provides bond pads structures between semiconductor integrated circuits and the chip package with enhanced resistance to fracture and improved reliability. Mismatch in the coefficient of temperature expansion (CTE) among the materials used in bond structures induces stress and shear on them that may result in fractures within the back end dielectric stacks and cause reliability problems of the packaging. By placing multiple metal pads which are connected to the bond pad through multiple metal via, the adhesion between the bond pads and the back end dielectric stacks is enhanced.
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