Method for decreasing surface delamination of gel-type thermal interface material by management of the material cure temperature

摘要

Various methods and apparatus for establishing a thermal pathway for a semiconductor device are disclosed. In one aspect, a method of manufacturing is provided that includes placing a gel-type thermal interface material in a preselected pattern on a semiconductor chip that is coupled to a substrate. The preselected pattern of gel-type thermal interface material is allowed to partially set up. Additional thermal interface material is placed on the semiconductor chip and cured.