MICROPATTERN FORMING METHOD, MICROPATTERN FORMING DEVICE, AND CIRCUIT ELEMENT

摘要

Disclosed are a micropattern forming method and a micropattern forming device enabling control of the shapes and pitches of pattern constituent elements and not requiring giving an artificial driving force to the droplet and the substrate when a micropattern is formed.The micropattern forming method includes step S1 of placing a first substrate having a surface-treated surface and a large number of pinning sites formed thereon, step S2C of placing a second substrate apart from the first substrate in such a way as to face the surface-treated surface of the first substrate, step S2D of sealing a solution into the space defined between the first and second substrates, step S3 of drying/contracting the solution and moving the contact line of the solution on the surface-treated surface while pinning/depinnin the contact line at a pinning site. When the contact line of the solution is pinned, the solute in the solution is deposited on the second substrate, and a pattern is formed.