ASSEMBLY FOR COMPENSATING FOR THE THERMAL EXPANSION IN HOT RUNNER MANIFOLD ASSEMBLIES OF MELT-CONDUCTING SYSTEMS IN INJECTION MOLDING TOOLS

摘要

The invention relates to an assembly for compensating for the thermal expansion of hot runner manifold assemblies in melt-conducting systems of injection molding tools, particularly for plastic materials or rubber. In such tools, high temperature differences occur between the melt, manifold assembly and tool, which lead to an offset between the components of the hot runner manifold assembly. This interferes with the smooth flow of the melt. It is proposed to provide articulated connecting elements between the individual components of hot runner manifold assemblies, which elements compensate for any offset that occurs. Due to the special configuration of the elements and/or a special mount of the distributor units in the tool, a smooth flow of the melt is ensured, whereby the quality of the injection-molded parts can be increased and the process reliability for the injection molding operation can be improved.