Electrochemical treatment of metal inserts for subsequent assembly injection molding of tight electronic systems

摘要

One method to produce electronic systems with high resilience is the encapsulation of metal inserts, for example, lead frames, using assembly injection molding. Such parts are exposed to different mediums, such as water and oil, which can infiltrate and damage the electronic system, especially in automotive applications. Hence, one challenge is to ensure the tightness. The research covered in this paper focuses on the assembly injection molding of tight electronic systems using microstructured metal inserts, manufactured by a two-stage electrochemical treatment. The effects of the electrochemical treatment on the tightness and the bond between metal and polymer of the electronic system are investigated. Furthermore, the influence of the electrochemical treatment on the surface and geometry of the metal insert is evaluated.