Disclosed is a process that can stably produce a fixed abrasive grain wire provided with a covering of a metal plating layer with a plurality of abrasive grains incorporated therein. A metallic wire is immersed in an electrolysis solution containing a plurality of abrasive grains and cations of a metal to be plated. A suitable potential difference is provided between an anode and a cathode which is the metallic wire, whereby the plurality of abrasive grains contained in the electrolysis solution and a metal produced from the cations by a reduction are deposited on the surface of the metallic wire as the cathode to produce a fixed abrasive grain wire provided with a covering of a metal plating layer containing a plurality of abrasive grains. The abrasive grains contained in the electrolysis solution have a surface that has been previously plated with a metal having a lower ionization tendency than silver.
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