首页> 外国专利> SEMICONDUCTOR SUBSTRATE SUPPORT SUSCEPTOR FOR VAPOR-PHASE EPITAXY, EPITAXIAL WAFER MANUFACTURING DEVICE, AND EPITAXIAL WAFER MANUFACTURING METHOD

SEMICONDUCTOR SUBSTRATE SUPPORT SUSCEPTOR FOR VAPOR-PHASE EPITAXY, EPITAXIAL WAFER MANUFACTURING DEVICE, AND EPITAXIAL WAFER MANUFACTURING METHOD

机译:汽相外延的半导体衬底支持载体,外延晶圆制造设备和外延晶圆制造方法

摘要

Disclosed is a susceptor that supports a semiconductor substrate during vapor-phase epitaxy. Said susceptor is provided with a counterbore in which the semiconductor substrate is placed. The top surface of the susceptor has a tapered section tapered up or down outwards from the edge of the counterbore. By thereby controlling the epitaxial layer thickness around the edge of a principal surface of an epitaxial wafer, the disclosed susceptor can make the epitaxial wafer flatter. Also disclosed is an epitaxial wafer manufacturing device using the disclosed susceptor.
机译:公开了一种在气相外延期间支撑半导体衬底的基座。所述基座设有沉孔,在沉孔中放置有半导体衬底。基座的顶表面具有锥形部分,该锥形部分从沉孔的边缘向外或向下逐渐变细。通过由此控制外延晶片的主表面的边缘周围的外延层的厚度,所公开的基座可以使外延晶片更平坦。还公开了使用所公开的基座的外延晶片制造装置。

著录项

  • 公开/公告号WO2011105010A1

    专利类型

  • 公开/公告日2011-09-01

    原文格式PDF

  • 申请/专利权人 SHIN-ETSU HANDOTAI CO. LTD.;MASUMURA HISASHI;

    申请/专利号WO2011JP00462

  • 发明设计人 MASUMURA HISASHI;

    申请日2011-01-28

  • 分类号H01L21/205;C23C16/458;C30B25/12;H01L21/683;

  • 国家 WO

  • 入库时间 2022-08-21 17:55:59

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