首页> 外国专利> Joining of metallic and/or ceramic materials with the help of a glass ceramic filler material and a laser beam; Joint with two metallic and/or ceramic materials parts

Joining of metallic and/or ceramic materials with the help of a glass ceramic filler material and a laser beam; Joint with two metallic and/or ceramic materials parts

机译:在玻璃陶瓷填充材料和激光束的帮助下将金属和/或陶瓷材料连接起来;与两个金属和/或陶瓷材料零件接合

摘要

The method comprises creating a hole in one of the components to be connected using a focused laser, supplying a bore of a ceramic filler material, melting the glass-ceramic filler material by energy input of the defocused laser, forming a gas-tight material connection between the components to be joined, inserting a carbon dioxide laser, a neodymium:yttrium aluminum garnet (Nd:YAG) laser, a fiber laser or a laser disc, and establishing a point-like joint connection. A binder-free solder is used as a glass-ceramic filler. The powdered glass solder is added on one side of a vibration unit. The method comprises creating a hole in one of the components to be connected using a focused laser, supplying a bore of a ceramic filler material, melting the glass-ceramic filler material by energy input of the defocused laser, forming a gas-tight material connection between the components to be joined, inserting a carbon dioxide laser, a neodymium:yttrium aluminum garnet (Nd:YAG) laser, a fiber laser or a laser disc, and establishing a point-like joint connection. A binder-free solder is used as a glass-ceramic filler. The powdered glass solder is added on one side of a vibration unit. The focusing/defocusing of the laser is carried out by a relative movement of the laser to the components to be joined by an optical device. The components to be joined are arranged in an assembly at a distance of 0.1-2 mm. The laser is continuously operated during the entire assembly process. The first component at the site of drilling exhibits a maximum thickness of 1.5 mm. The bonding material is added to the drilling site prior to the creation of the hole in the first component of bonding material, and the bonding material is melted by the energy input of the laser. The laser drilling of the first component is carried out through the melted bonding material, so that the drilling of molten joining material is carried out through the bore between the components to be joined. An independent claim is included for a joint between two metal and/or ceramic surface components.
机译:该方法包括:使用聚焦激光器在要连接的组件之一中创建孔;供应陶瓷填充材料的孔;通过散焦激光器的能量输入熔化玻璃陶瓷填充材料;形成气密性材料连接在要连接的组件之间插入二氧化碳激光器,钕钇铝石榴石(Nd:YAG)激光器,光纤激光器或激光光盘,并建立点状接头连接。无粘结剂的焊料用作玻璃陶瓷填料。将粉末状的玻璃焊料添加到振动单元的一侧。该方法包括:使用聚焦激光器在要连接的组件之一中创建孔;供应陶瓷填充材料的孔;通过散焦激光器的能量输入熔化玻璃陶瓷填充材料;形成气密性材料连接在要连接的组件之间插入二氧化碳激光器,钕钇铝石榴石(Nd:YAG)激光器,光纤激光器或激光光盘,并建立点状的接头连接。无粘结剂的焊料用作玻璃陶瓷填料。将粉末状的玻璃焊料添加到振动单元的一侧。激光的聚焦/散焦是通过激光相对于待通过光学装置接合的部件的相对运动来进行的。待连接的组件以0.1-2 mm的距离布置在一个组件中。激光在整个组装过程中连续运行。钻孔部位的第一部分最大厚度为1.5毫米。在粘结材料的第一部件中形成孔之前,将粘结材料添加到钻孔位置,并且粘结材料通过激光的能量输入而熔化。第一部件的激光钻孔是通过熔化的粘结材料进行的,因此熔融的连接材料的钻孔是通过待结合的部件之间的孔进行的。对于两个金属和/或陶瓷表面组件之间的接合处,包含独立权利要求。

著录项

  • 公开/公告号EP2380690A1

    专利类型

  • 公开/公告日2011-10-26

    原文格式PDF

  • 申请/专利权人 FORSCHUNGSZENTRUM JUELICH GMBH;

    申请/专利号EP20110002397

  • 发明设计人 FAIDELDIETRICH;BEHR WILFRIED;REISGEN UWE;

    申请日2011-03-23

  • 分类号B23K1;B23K1/005;B23K26/22;B23K26/24;B23K26/20;C04B37;H01M8/02;

  • 国家 EP

  • 入库时间 2022-08-21 17:53:22

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