首页> 外国专利> POLYAMIDEIMIDE RESIN FOR A FLEXIBLE PRINTED WIRING PLATE HAVING THE EXCELLENT FLEXIBILITY AND FIRE RETARDANT PROPERTY, A METAL CLAD LAMINATE PLATE USING THEREOF, A COVERLAY, THE FLEXIBLE PRINTED WIRING PLATE, AND A RESIN COMPOSITION

POLYAMIDEIMIDE RESIN FOR A FLEXIBLE PRINTED WIRING PLATE HAVING THE EXCELLENT FLEXIBILITY AND FIRE RETARDANT PROPERTY, A METAL CLAD LAMINATE PLATE USING THEREOF, A COVERLAY, THE FLEXIBLE PRINTED WIRING PLATE, AND A RESIN COMPOSITION

机译:具有优异柔性和阻燃性能的柔性印刷线路板的聚酰亚胺树脂,使用其的金属复合板,覆盖层,柔性印刷线路板和树脂成分

摘要

PURPOSE: A polyamideimide resin, a metal clad laminate plate using thereof, a coverlay, a flexible printed wiring plate, and a resin composition are provided to secure the workability and the solubility before curing, and the solder dip resistance after curing.;CONSTITUTION: A polyamideimide resin for a flexible printed wiring plate is obtained by reacting an acid component with one anhydride and aromatic dicarboxylic acid, a diisocyanate compound, and a diamine compound. The molar amount of the anhydride is 0.4~0.8 for the amount of the acid component. A metal clad laminate plate(100) is formed by locating the polyamideimide resin(110) on a metal foil(120) in a layered form.;COPYRIGHT KIPO 2011
机译:目的:提供聚酰胺酰亚胺树脂,使用其的覆金属层压板,覆盖层,柔性印刷线路板和树脂组合物,以确保固化前的可加工性和溶解性以及固化后的耐焊锡性。通过使酸成分与一种酸酐和芳香族二羧酸,二异氰酸酯化合物和二胺化合物反应,得到用于挠性印刷线路板的聚酰胺酰亚胺树脂。酸酐的摩尔量相对于酸成分为0.4〜0.8。通过将聚酰胺酰亚胺树脂(110)分层放置在金属箔(120)上形成覆金属层压板(100)。COPYRIGHTKIPO 2011

著录项

  • 公开/公告号KR20100125215A

    专利类型

  • 公开/公告日2010-11-30

    原文格式PDF

  • 申请/专利权人 ARISAWA MFG. CO. LTD.;

    申请/专利号KR20100114496

  • 发明设计人 TAI MAKOTO;DOBASHI SHU;

    申请日2010-11-17

  • 分类号C08G73/14;C08G73/00;C08L77/00;H05K3/46;

  • 国家 KR

  • 入库时间 2022-08-21 17:53:13

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