INVERSELY ALTERNATE STACK OF INTEGRATED CIRCUIT MODULES, CAPABLE OF EXPANDING THE CAPACITY OF A MEMORY IN A LIMITED HEIGHT

摘要

PURPOSE: The inversely alternate stack of integrated circuit modules is provided to improve heat emitting efficiency by installing a spring strip set to the integrated circuit modules.;CONSTITUTION: An integrated circuit module is composed of a substrate(11), an integrated circuit chip(12), and a shaped body(13). The substrate functions as a chip carrier and a transmission interface. An access controlling chip(14) is in connection with the integrated circuit chip, an external contact pad(113), and a switch contact pad(114). The shaped body is formed in the substrate. The integrated circuit chip and the access controlling chip are mounted in the shaped body.;COPYRIGHT KIPO 2011