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LOW SILICON-BASED ALUMINUM ALLOY, WHICH CAN OMIT A THERMAL PROCESS BY INCLUDING A PROPER AMOUNT OF SILICON AND A LARGE AMOUNT OF ZINC
LOW SILICON-BASED ALUMINUM ALLOY, WHICH CAN OMIT A THERMAL PROCESS BY INCLUDING A PROPER AMOUNT OF SILICON AND A LARGE AMOUNT OF ZINC
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机译:低硅基铝合金,可以通过包括适当量的硅和大量的锌来省略热过程
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摘要
PURPOSE: A low silicon-based aluminum alloy, which can omit a thermal process by including a proper amount of silicon and a large amount of zinc, is provided to maintain the abrasion resistance corresponding to aluminum silicon alloy and to improve the mechanical property.;CONSTITUTION: A low silicon-based aluminum alloy comprises zinc 38~43 weight%, copper 3~5 weight%, silicon 4~6 weight%, manganese 0.2~0.5 weight% and the rest composed of the inevitable impurity and aluminum. Soft particle(Al, Zn) and hard particle(Si, Al2Cu) are uniformly distributed on the micro-structure of the base silicon aluminum alloy. Silicon hard particles of 25μm are finely and evenly distributed.;COPYRIGHT KIPO 2011
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