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SEMICONDUCTOR DEVICE METAL CONTACT FORMING METHOD, CAPABLE OF PREVENTING THE GENERATION OF A BRIDGE DURING FORMING THE METAL WITH THE SEAM
SEMICONDUCTOR DEVICE METAL CONTACT FORMING METHOD, CAPABLE OF PREVENTING THE GENERATION OF A BRIDGE DURING FORMING THE METAL WITH THE SEAM
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机译:半导体装置的金属接触成形方法,能够防止在金属与焊缝成形过程中桥接的产生
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摘要
PURPOSE: A semiconductor device metal contact forming method is provided to prevent the generation of the bridge during forming the metal contact by removing the seam which occurs in the intermediate layer using a barrier layer.;CONSTITUTION: A capacitor having the cylinder type storage electrode(150) is formed on a semiconductor substrate(100). An intermediate insulation layer(180) is formed on the result material formed with the capacitor. A contact hole is formed to form the metal contact by etching the intermediate insulation layer. A barrier film(200) consisting of the tantalum oxide is formed on the sidewall of the contact hole.;COPYRIGHT KIPO 2011
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