PURPOSE: A light emitting diode chip inspecting apparatus equipped with a light emitting diode chip transferring unit and a light emitting diode chip transferring method using the same are provided to minimize the breakage of a light emitting diode chip while the light emitting diode chip is transferred using a gripper. CONSTITUTION: A wafer includes light emitting diode chips and the adhering faces of the light emitting diode chips. A stage(163) is arranged on the bottom side of the wafer and includes needles and curved surfaces. The needles pressurize the bottom side of the light emitting diode chips. A gripper(161) inhales the light emitting diode chips on the upper side of the wafer and transfers the inhaled light emitting diode chips.
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