METALIZED POLYIMIDE FILM AND A FLEXIBLE PRINTED CIRCUIT BOARD USING THE SAME, CAPABLE OF HAVING INITIAL ADHESIVENESS OVER 900N/M AND HAVING ADHESIVE STRENGHT AFTER PCT TEST OVER 600N/M

摘要

PURPOSE: A metalized polyimide film and flexible printed circuit board using the same are provided to have initial adhesiveness over 900N/m and have adhesive strength after PCT test over 600N/m.;CONSTITUTION: A metal layer is directly formed on a surface of a polyimide film by plating method. The polyimide film has oxygen transmission approximately 300~500cm^2/m^2/24h and absorption rate 1~3% under 1013 hPa when film thickness is 35 μm. The polyimide film has thermal expansion coefficient approximately 10ppm/°C~18ppm/°C. The polyimide film includes imide coupling among polyimide molecule by biphenyl tetracarbonic acid and diamine compound. When the TD direction of a surface is thin film X diffraction measured, a half width is less than 1.5° in 2Θ=12°~18°.;COPYRIGHT KIPO 2011