BSI IMAGE SENSOR AND A METHOD FOR MANUFACTURING AN IMAGE SENSOR, CAPABLE OF IMPROVING PRODUCTIVITY

摘要

PURPOSE: A BSI image sensor and a method for manufacturing an image sensor are provided to reduce manufacturing costs by forming a trench for connecting metal wires to a semiconductor substrate and an epi layer.;CONSTITUTION: A semiconductor substrate is classified into a pixel region and a pad region. The epi layer(110) is formed on the semiconductor substrate. A photo diode(117) is formed at the active region between element isolation films in the pixel region. An insulating material layer(139) comprises a plurality of metal wirings formed on the epi layer In the pad region, a tungsten plug connects the plural metal wirings to the semiconductor substrate and the epi layer. A handle wafer is bonded with the insulating material layer including the plural metal wires.;COPYRIGHT KIPO 2011