SEMICONDUCTOR DEVICE WITH PADS, CAPABLE OF PREVENTING RELIABILTY FROM BEING LOWERED IN A PACKAGING PROCESS BY A PROBING MARK

摘要

PURPOSE: A semiconductor device with pads is provided to have a plurality of sensor pads considering a progressing direction of a probe, thereby maximizing efficiency of checking a probe during an EDS(Electric Die Sort) test process.;CONSTITUTION: A plurality of sensor pads receives a probe signal from a test device. A sensor pad includes an insulation unit and a conductive unit arranged on the center part of the sensor pad. The conductive unit is arranged on an edge part of the sensor pad. A plurality of normal pads receives a driving signal for driving the semiconductor device.;COPYRIGHT KIPO 2011