首页> 外国专利> TRANSPARENT ELECTRICALLY CONDUCTIVE TRANSFER PLATE AND PRODUCTION METHOD THEREFOR, TRANSPARENT ELECTRICALLY CONDUCTIVE BASE, METHOD FOR PRODUCING TRANSPARENT ELECTRICALLY CONDUCTIVE BASE USING TRANSPARENT ELECTRICALLY CONDUCTIVE TRANSFER PLATE, AND MOLDED ARTICLE USING TRANSPARENT ELECTRICALLY CONDUCTIVE BASE

TRANSPARENT ELECTRICALLY CONDUCTIVE TRANSFER PLATE AND PRODUCTION METHOD THEREFOR, TRANSPARENT ELECTRICALLY CONDUCTIVE BASE, METHOD FOR PRODUCING TRANSPARENT ELECTRICALLY CONDUCTIVE BASE USING TRANSPARENT ELECTRICALLY CONDUCTIVE TRANSFER PLATE, AND MOLDED ARTICLE USING TRANSPARENT ELECTRICALLY CONDUCTIVE BASE

机译:透明导电体及其制造方法,透明导电体,使用透明导电体制造透明导电体的方法,以及使用透明导电体的铸模

摘要

The present invention provides a process for producing a transparent conductive substrate which is capable of readily producing the transparent conductive substrate having a low resistance, a high transmittance and an excellent anti-moire property without using a special apparatus and can be applied to production of various extensive substrates; a transparent conductive substrate having a sufficiently high optical transparency and electromagnetic shielding property which can be readily subjected to molding process as well as a process for producing the transparent conductive substrate; and a transparent conductive molded product. According to the present invention, it is possible to readily produce a transparent conductive substrate having a low resistance, a high transmittance and an excellent anti-moire property which can be applied to extensive substrates by applying a dispersion solution of metal fine particles capable of forming a self-organized film on a support, drying the obtained coating layer and then subjecting the resulting dried material to heat treatment and/or chemical treatment or applying a solution of a precursor of the metal fine particles on a support, drying the obtained coating layer and then reducing and precipitating the precursor of the metal fine particles, to previously form a transparent conductive film exhibiting a low resistance, a high transmittance and an excellent anti-moire property and having a conductive random network structure on the support; and then bonding a substrate to the support to transfer the transparent conductive film onto the substrate directly or through a heat-sensitive adhesive layer or a pressure-sensitive adhesive layer and releasing the support from the transparent conductive film is laminated on a substrate.
机译:本发明提供了一种透明导电基板的制造方法,该方法能够不使用专用设备而容易地制造具有低电阻,高透射率和优异的莫尔条纹的透明导电基板,并且能够应用于各种制造中。广泛的底材;具有足够高的光学透明性和电磁屏蔽性的透明导电性基板,该透明导电性基板可以容易地进行成型处理以及透明导电性基板的制造方法。透明导电成型品。根据本发明,可以容易地制造具有低电阻,高透射率和优异的抗莫尔条纹的透明导电性基板,该透明导电性基板通过涂布能够形成的金属微粒的分散液,可以应用于广泛的基板。在载体上的自组织膜,干燥所得的涂层,然后将所得的干燥材料进行热处理和/或化学处理,或将金属微粒的前体的溶液涂布在载体上,干燥所得的涂层然后还原和沉淀金属微粒的前体,以预先形成具有低电阻,高透射率和优异的抗莫尔条纹特性并且在载体上具有导电无规网络结构的透明导电膜。然后将基材粘合到支撑体上,以将透明导电膜直接或通过热敏粘合剂层或压敏粘合层转移到基材上,并从透明导电膜上剥离支撑体。

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