首页> 外国专利> IMPROVED MANUFACTURING METHOD OF CRYSTAL MATERIALS ON A FLAT SURFACE INCLUDING A SEMICONDUCTOR CRYSTAL MATERIAL AND STRUCTURES

IMPROVED MANUFACTURING METHOD OF CRYSTAL MATERIALS ON A FLAT SURFACE INCLUDING A SEMICONDUCTOR CRYSTAL MATERIAL AND STRUCTURES

机译:包括半导体晶体材料和结构的扁平表面上的晶体材料的改进制造方法

摘要

PURPOSE: An improved manufacturing method of crystal materials and structures are provided to reduce roughness by generating process parameters to reduce impurities on an interface between first and second semiconductor crystal materials.;CONSTITUTION: A composite structure includes a first semiconductor crystal material on a second semiconductor crystal material with a high aspect ratio. The composite structure has a flat surface. A strained second semiconductor crystal material(140) is arranged on the first semiconductor crystal material on the flat surface. The surface of the first semiconductor crystal material has the surface roughness of 5 nm or less. The interface between the first and second semiconductor crystal materials has the reduced impurity density.;COPYRIGHT KIPO 2011
机译:目的:提供一种改进的晶体材料和结构的制造方法,以通过产生工艺参数以减少第一和第二半导体晶体材料之间的界面上的杂质来降低粗糙度。;构成:一种复合结构,包括在第二半导体上的第一半导体晶体材料高纵横比的晶体材料。复合结构具有平坦的表面。应变的第二半导体晶体材料(140)布置在平坦表面上的第一半导体晶体材料上。第一半导体晶体材料的表面具有5nm或更小的表面粗糙度。第一和第二半导体晶体材料之间的界面具有降低的杂质密度。; COPYRIGHT KIPO 2011

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