LIGHT EMITTING DIODE PACKAGE SECURING LIGHT WHICH IS SIMILAR TO SUNLIGHT AND A MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A light emitting diode package and a manufacturing method thereof are provided to simply implement various kinds of light source which is similar to sunlight by including a common spectrum waveform change material mixing layer.;CONSTITUTION: A package substrate(10) has a housing(12) with a cavity. An LED package group(20) includes a single waveform LED package(22,24,26,28) which emits light with different wavelength on the package substrate. The single wavelength LED package respectively includes light emitting diode chips(22a,24a,26a,28a). A passivation layer(14) is formed on the LED package group and the exposed package substrate to fill cavity.;COPYRIGHT KIPO 2011