首页> 外国专利> LIGHT EMITTING DIODE PACKAGE STRUCTURE CAPABLE OF PROVIDING THE INTEGRATED DESIGN FUNCTION OF AN OPTICAL PATH

LIGHT EMITTING DIODE PACKAGE STRUCTURE CAPABLE OF PROVIDING THE INTEGRATED DESIGN FUNCTION OF AN OPTICAL PATH

机译:提供光路综合设计功能的发光二极管封装结构

摘要

PURPOSE: A light emitting diode package structure is provided to lock a transparent cover and select the position of the transparent cover by including a wall on the upper surface of the structure.;CONSTITUTION: An LED package structure(10) includes a housing(12), an LED chip(14), a transparent cover, and a wall(24). The housing has an upper surface, a cavity, and a surrounding plane. The LED chip is arranged on the lower surface of the cavity. The transparent cover is arranged on the surrounding plane and seals the opening of the cavity. The surrounding wall is arranged on the upper surface of the housing and surrounds the transparent cover.;COPYRIGHT KIPO 2011
机译:目的:提供一种发光二极管封装结构,以锁定透明盖并通过在结构的上表面上包括壁来选择透明盖的位置。组成:LED封装结构(10)包括外壳(12) ),LED芯片(14),透明盖和壁(24)。壳体具有上表面,空腔和周围平面。 LED芯片布置在空腔的下表面上。透明盖布置在周围平面上并且密封腔的开口。围墙布置在外壳的上表面并围绕透明盖。; COPYRIGHT KIPO 2011

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