METHOD FOR MANUFACTURING EMBEDDED PRINTED CIRCUIT BOARD CAPABLE OF REDUCING MANUFACTURING COST OF CARRIER SUBSTRATE AND CARRIER SUBSTRATE USED THEREFOR

摘要

PURPOSE: A method for manufacturing an embedded printed circuit board and a carrier substrate used therefore are provided to stabilize a process by using a stainless steel carrier substrate. ;CONSTITUTION: A carrier substrate is manufactured by forming plating layers(120,130) on both sides of a stainless steel(110). An element(140) is mounted on one surface of the carrier substrate. An insulating layer(150) is laminated on an upper surface of the carrier substrate. A metal layer(160) is laminated on an upper surface of the insulating layer. The plating layer in which the stainless steel and the element are not mounted is removed. A circuit pattern is formed on the metal layer.;COPYRIGHT KIPO 2011