首页> 外国专利> LED MODULE HAVING A HIGH HEAT RADIATION PROPERTY AND A METHOD FOR MANUFACTURING THE SAME, HAVING AN LED DEVICE DIRECTLY ATTACHED TO A HEAT SINK

LED MODULE HAVING A HIGH HEAT RADIATION PROPERTY AND A METHOD FOR MANUFACTURING THE SAME, HAVING AN LED DEVICE DIRECTLY ATTACHED TO A HEAT SINK

机译:具有高散热性能的LED模块及其制造方法,将LED装置直接安装在散热片上

摘要

PURPOSE: An LED module having a high heat radiation property and a method for manufacturing the same are provided to maximize the radiation efficiency of an LED module by minimizing a thermal conductive path to a heat sink from an LED device.;CONSTITUTION: In an LED module having a high heat radiation property and a method for manufacturing the same, An LED element(200) is attached on a lower heat sink(240). A thermal conductive material(220) is formed between the LED element and the lower heat sink. A concave groove(250) is formed in the lower heat sink. An upper heat sink(230) controls the direction angle of a light radiated from the LED device. A wire is inserted into the groove to electrically connect the LED device.;COPYRIGHT KIPO 2011
机译:目的:提供具有高散热性的LED模块及其制造方法,以通过使从LED装置到散热器的导热路径最小化来最大化LED模块的辐射效率。具有高散热性的模块及其制造方法,在下部散热器(240)上安装LED元件(200)。在LED元件和下部散热器之间形成导热材料(220)。在下部散热器中形成有凹槽(250)。上部散热器(230)控制从LED装置辐射的光的方向角。电线插入凹槽中以电连接LED器件。; COPYRIGHT KIPO 2011

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