SUBSTRATE PLATING APPARATUS WITH IMPROVED PLATING EFFICIENCY

摘要

PURPOSE: A substrate plating apparatus is provided to increase the amount of metal ions transferred to a substrate by activating the movement of the metal ions. ;CONSTITUTION: A substrate plating apparatus comprises an inner chamber(110), an electrolyte supply line(130), and a filtering unit(140). The inner chamber accepts electrolyte. A target unit(120) is arranged in the inner chamber and generates metal ions when positive electrodes are applied to the inner bottom of the inner chamber. The electrolyte supply line is connected to an external electrolyte supply unit and supplies electrolyte to the inner chamber. The filtering unit is coupled to the top of the inner chamber and filters metal ions.;COPYRIGHT KIPO 2011