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FUSE OF SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, CAPABLE OF PREVENTING CONNECTION BETWEEN CUT FUSE AND ADJACENT FUSE BY FUSE RESIDUAL OF LASER CUTTING PROCESS
FUSE OF SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, CAPABLE OF PREVENTING CONNECTION BETWEEN CUT FUSE AND ADJACENT FUSE BY FUSE RESIDUAL OF LASER CUTTING PROCESS
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机译:半导体器件的熔断及其制造方法,能够通过激光切割过程中的熔断残余防止熔断和相邻熔断之间的连接
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摘要
PURPOSE: A fuse of a semiconductor device and a manufacturing method thereof are provided to solve fuse fault occurred during fuse cutting by changing the shape of a fuse open region. ;CONSTITUTION: A number of fuse lines(205) are formed on a semiconductor substrate(200). An interlayer insulation film and a protection film(203) are formed on top of the fuse line. A fuse open region(210) is formed by etching the protection film and the interlayer insulation film in sequence. The fuse line exposed by the fuse open region is cut. The fuse open region includes a number of concave-convex parts among the fuse lines.;COPYRIGHT KIPO 2011
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