STRUCTURE FOR MULTI-ROW LEAD FRAME AND A MANUFACTURING METHOD THEREOF, CAPABLE OF SIMPLIFYING A PROCESS AND REDUCING PRODUCTION COSTS

摘要

PURPOSE: A structure for multi-row lead frame and a manufacturing method thereof are provided to implement multilayer plating without flash plating and form a circuit through only plating pattern without half-etching of a lead frame source material. ;CONSTITUTION: In a structure for multi-row lead frame and a manufacturing method thereof, a photosensitive material(120) is spread in the lead frame source material(110) to form a first pattern. At least one plating pattern comprised of a Pd, Ni, and Pd layer by using Au as a base layer. The first pattern is used for an I/O or a die pad.;COPYRIGHT KIPO 2011