BONDING MATERIAL FOR A SPUTTERING TARGET TO ATTACH A SPUTTERING TARGET MATERIAL AND A SUPPORTING MATERIAL AND A SPUTTERING TARGET USING THE SAME

摘要

PURPOSE: A bonding material for a sputtering target and a sputtering target using the same are provided to prevent crack of a sputtering target material when attaching the sputtering target material to a supporting material and the bending of the supporting material caused by heating. ;CONSTITUTION: A sputtering target comprises a supporting material(11), a sputtering target material(12), and a bonding material(13). The supporting material is formed in a cylindrical shape. The sputtering target material is attached to the supporting material by the bonding material to form a thin film. The bonding material is formed by mixing tin metal and indium metal, where the content of the tin metal is 48~50 weight% and the melting point is 120~125°C.;COPYRIGHT KIPO 2011