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ELECTROLESS NICKEL-PLATING SOLUTION COMPOSITION WHICH CAN FORM A NICKEL PLATING LAYER HAVING SOLDERABILITY, FLEXIBILITY, AND CRACK RESISTANCE
ELECTROLESS NICKEL-PLATING SOLUTION COMPOSITION WHICH CAN FORM A NICKEL PLATING LAYER HAVING SOLDERABILITY, FLEXIBILITY, AND CRACK RESISTANCE
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机译：可以形成具有可焊性，灵活性和抗裂性的镍镀层的化学镀镍溶液组合物
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摘要
PURPOSE: An electroless nickel-plating solution composition is provided to form a nickel plating layer having solderability, flexibility, and crack resistance by inputting vertical growth inducer. ;CONSTITUTION: An electroless nickel-plating solution composition comprises aqueous nickel compound, a reducing agent, a complex agent, and a vertical growth inducer. The vertical growth inducer comprises the compound having bismuth ion. The composition range of the vertical growth inducer based on the entire content of the electroless nickel plating solution composition is 0.001~1wt.%.;COPYRIGHT KIPO 2011
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