MULTI-LAYERED STRUCTURE MANUFACTURING PROCESS WITH TRIMMING USING THERMAL-MECHANICAL EFFECTS FOR MANUFACTURING A MULTI-LAYERED STRUCTURE

摘要

PURPOSE: A multi-layered structure manufacturing process with trimming using thermal-mechanical effects is provided to solve a problem of peel-off.;CONSTITUTION: The edge of a first wafer(110) is trimmed using a grinding wheel(150) before a step which is making a thin first wafer. A work surface(151) of the grinding wheel includes grit particles with an average size of 18 micron or less or 800 mesh or greater. A trimming step is performed by lowering the descent speed of the grinding wheel as 5 micron per second or greater. The grinding wheel lowering within the first wafer is stopped at a height(h110) of 39 micro meters or grater from a bonding interface.;COPYRIGHT KIPO 2012