HEATER CHUCK USING ALUMINUM WHICH IS COMPRISED OF USING A NEWLY DEVELOPED ALUMINUM HEATER IN ORDER TO SOLVE A PROBLEM IN AN EXISTING WAFER CHUCK FOR FIXING A WAFER USED IN SEMICONDUCTOR MANUFACTURING AND A FILM PROCESSING METHOD THEREOF

摘要

PURPOSE: A heater chuck using aluminum and a film processing method thereof are provided to perform coating with a combining structure through a chemical interaction with the surface of raw materials, thereby preventing the degradation of raw materials with superior thermal and chemical properties.;CONSTITUTION: A target processing object is placed in an upper plate(11). A lower plate(12) is combined with the upper plate. A heating damper(13) is inserted between the upper plate and lower plate. A thick film heater(14) is placed under the heating damper and heats a wafer. A shaft(16) is placed under the thick film heater and supports the whole by being combined with a heat insulating plate and the lower plate. The heat insulating plate blocks the transfer of heat from the thick film heater to the outside. The upper plate and lower plate are made of Al 6061-T651 heat treating alloy. The heating damper and thick film heater are arranged with Al, a films screen, and STS310S. The heat insulating plate is arranged with Al2O3.;COPYRIGHT KIPO 2012