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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF CAPABLE OF IMPROVING A REFRESH PROPERTY BY REDUCING A GATE INDUCED DRAIN LEAKAGE
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF CAPABLE OF IMPROVING A REFRESH PROPERTY BY REDUCING A GATE INDUCED DRAIN LEAKAGE
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机译:通过减少门引起的漏泄而能够改善刷新性能的半导体装置及其制造方法
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摘要
PURPOSE: A semiconductor device and a manufacturing method thereof are provided to improve a resistance property by increasing a contact area between a junction area and storage node and bit line contact plugs.;CONSTITUTION: A device isolation layer(104) defining an active area(102) is formed on a semiconductor substrate(100). A buried gate(G) is formed in the device isolation layer and the active area of the semiconductor substrate. A silicon layer is formed in the active area between the buried gates. A junction area(116S,116D) is formed in the silicon layer and the active area to be overlapped with the buried gate. A bit lien contact plug(120) and a storage contact plug(124) are formed in the junction area.;COPYRIGHT KIPO 2012
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