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SOLVENTLESS RELEASER COMPOSITION FOR USE WITH SILICONE PRESSURE-SENSITIVE ADHESIVES AND RELEASE LINER

机译:与硅树脂压敏胶和防粘衬里一起使用的溶剂型释放剂组合物

摘要

PROBLEM TO BE SOLVED: To provide a release agent composition for a solventless silicone adhesive, which can be applied to a substrate in a solventless state and gives a cured film which is excellent in adhesiveness, has a low peeling strength, and shows a small reduction in a residual adhesion rate, and to provide a release sheet in which a cured film of the composition is formed on a substrate surface.;SOLUTION: The release agent composition for a solventless silicone adhesive comprises: (A) an organopolysiloxane which has at least two alkenyl groups bonded to a silicon atom and at least one monovalent fluorine-containing substituent bonded to a silicon atom in one molecule, has a fluorine content in a molecule of 30 to 50 mass%, and has a viscosity at 25°C of 100 to 2,000 mPa s; (B) an organohydrogenpolysiloxane which has at least three hydrogen atoms bonded to a silicon atom in one molecule; (C) a reaction controlling agent; and (D) a platinum group metal-based catalyst, wherein the composition has a viscosity at 25°C of 50 to 2,000 mPa s.;COPYRIGHT: (C)2012,JPO&INPIT
机译:解决的问题:提供一种用于无溶剂的有机硅粘合剂的脱模剂组合物,其可以以无溶剂的状态施加到基材上,并且获得具有优异的粘附性,低的剥离强度并且显示出较小的减少量的固化膜。 ;提供一种脱模片,其中在基材表面上形成组合物的固化膜。;解决方案:用于无溶剂有机硅粘合剂的脱模剂组合物包含:(A)一种有机聚硅氧烷,其至少具有在一个分子中与硅原子键合的两个烯基和与硅原子键合的至少一个单价含氟取代基,分子中的氟含量为30至50质量%,并且在25℃下的粘度为100到2,000 mPa s; (B)在一个分子中具有至少三个与硅原子键合的氢原子的有机氢聚硅氧烷; (C)反应控制剂; (D)铂族金属基催化剂,其中该组合物在25℃下的粘度为50至2,000 mPa s .;版权所有:(C)2012,JPO&INPIT

著录项

  • 公开/公告号KR20110113571A

    专利类型

  • 公开/公告日2011-10-17

    原文格式PDF

  • 申请/专利权人 SHIN-ETSU CHEMICAL CO. LTD.;

    申请/专利号KR20110031148

  • 发明设计人 YAMAGUCHI KOICHI;KISHITA HIROFUMI;

    申请日2011-04-05

  • 分类号C08L83/04;C09D183/04;C08J5/18;C08J7/04;

  • 国家 KR

  • 入库时间 2022-08-21 17:50:56

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