首页> 外国专利> PLASMA ETCHING DEVICE WITH A PUMPING UNIT FOR IMPROVING A PLASMA COMPONENT CAPABLE OF PREVENTING A STANDING WAVE EFFECT

PLASMA ETCHING DEVICE WITH A PUMPING UNIT FOR IMPROVING A PLASMA COMPONENT CAPABLE OF PREVENTING A STANDING WAVE EFFECT

机译:带有抽气装置的等离子刻蚀装置,用于提高等离子组件的防止瞬态波效应的能力

摘要

PURPOSE: A plasma etching device with a pumping unit for improving a plasma component is provide to precisely control a pumping port by controlling a through hole area through a through hole formed in a top ring and a bottom ring.;CONSTITUTION: A cylindrical etching chamber receives a wafer. A cylindrical electrostatic chuck unit(30) includes a bottom electrode which receives the wafer. A pumping unit(40) discharges byproducts and remaining gas in the etching chamber. A pumping port controls the plasma component and pressure in the etching chamber. A top electrode forms an electric field for plasma reaction process in the etching chamber. A voltage supply unit(60) applies RF voltage to a positive electrode to generate an electric field between the top electrode and the bottom electrode.;COPYRIGHT KIPO 2012
机译:用途:等离子刻蚀设备,具有用于改善等离子成分的抽气单元,可通过控制通过形成在顶环和底环上的通孔的通孔面积来精确控制抽气口。组成:圆柱形蚀刻腔接收晶圆。圆柱形静电吸盘单元(30)包括接收晶片的底部电极。泵送单元(40)排出蚀刻室中的副产物和剩余气体。泵送端口控制蚀刻室中的等离子体成分和压力。顶部电极在蚀刻室中形成用于等离子体反应过程的电场。电压供应单元(60)将RF电压施加到正极上,以在顶部电极和底部电极之间产生电场。; COPYRIGHT KIPO 2012

著录项

  • 公开/公告号KR20110113889A

    专利类型

  • 公开/公告日2011-10-19

    原文格式PDF

  • 申请/专利权人 HANSEOHK;

    申请/专利号KR20100033208

  • 发明设计人 KIM DONG SOO;

    申请日2010-04-12

  • 分类号H01L21/3065;H01L21/02;

  • 国家 KR

  • 入库时间 2022-08-21 17:50:53

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