DEVICE AND METHOD FOR TESTING A SEMICONDUCTOR DEVICE CAPABLE OF TESTING THE ELECTRIC PROPERTY OF A SEMICONDUCTOR DEVICE WHICH IS HEATED AT A TEST TEMPERATURE

摘要

PURPOSE: A device and method for testing a semiconductor device are provided to rapidly test the semiconductor device by picking up the semiconductor device with a pickup unit, alternatively rotating the pickup unit, and mounting the pickup unit on a test socket.;CONSTITUTION: A loading unit(100) loads one or more trays mounting a plurality of semiconductor devices. A heating plate(200) receives the semiconductor device from the tray of the loading unit through a first transfer tool and heats the semiconductor device. A test unit(300) includes a test module, a pair of pickup units, a rotation moving unit, and a linear moving unit. The test modules have test sockets mounting the semiconductor device to test the electric property of the semiconductor device heated by the heating plate. The pair of pickup units picks up a plurality of semiconductor devices. The rotation moving unit rotates the pair of pickup units between a device exchange position and a device test position. The linear moving unit linearly moves the pickup unit to mount or separate the semiconductor devices.;COPYRIGHT KIPO 2012