SEMICONDUCTOR PACKAGE STRUCTURE CAPABLE OF IMPROVING PHYSICAL PROPERTIES AND ELECTRICAL PROPERTIES

摘要

PURPOSE: A semiconductor package structure is provided to arrange support members in both lateral parts of semiconductor chips, thereby preventing the generation of cracks.;CONSTITUTION: A first semiconductor package(75) is comprised of first semiconductor chips(36,46,56,66) and a first support member(23). A second semiconductor package(145) is arranged on the first semiconductor package. The second semiconductor package is comprised of second semiconductor chips(96,106,116,126) and a second support member(132). The second semiconductor chips have a staircase shape to a second direction in both lateral parts. The second support member is touched with the first and second semiconductor chips while being placed in the other lateral part of the first semiconductor chips.;COPYRIGHT KIPO 2012