Thin film and wafer-bonded encapsulated in micro-electro-mechanical systems for the adhesive-prevention technology

摘要

Present invention is disclosed and has a number of the city. In one aspect, the invention relates to a thin film or wafer encapsulated MEMS, and manufacturing techniques of the present invention prevents the adhesive wafer or a thin film encapsulated MEMS or employing the manufacturing technology. In one embodiment, after the encapsulation of the MEMS, adhesion-preventing channel is formed by providing a "access" to the chamber into which a part or all of the active members of the machine structure or the electrode of the MEMS. Then, the adhesion-preventing channel through the adhesive-preventing fluid is introduced into (e.g., a gas or a gas vapor) the chamber. Adhesion-preventing liquid is one of the active member or the electrode of the machine structure, whereby some or all of the deposition, the pressure-sensitive adhesive on such member or the electrode layer (for example, a single layer coating or a self-set monolayer) and / or gas It provides a release molecules. Since the introduction of anti-fluid and / or applied, the adhesive-adhesive protection channel may be sealing, capping, plugging and / or closed to define and control the mechanical damping in the chamber environment. In this regard, it forms the environment for storing and / or receiving a sealing, capping and / or closure of the machine structure of the chamber into the chamber. The environment should not only predetermined, desired and / or selected mechanical damping of the mechanical structure provides a proper sealing. (For example, a gas or a gas vapor) final encapsulated fluid machine structure operation (e.g., pressure) variable in may be controlled, selected and / or designed to provide a desired and / or predetermined operating environment is. ; Encapsulation layer, sealing the chamber, the pressure-sensitive adhesive-protection channel, adhesion-preventing liquid, anisotropic etching, adhesion-prevention plugs, the trench, an insulating layer, a diffusion barrier, the anodic bonding, the cap wafer, the trap