APPARATUS FOR SLURRY SUPPLY CONTROL AND SLURRY FLOW CONTROL METHOD

摘要

The present invention relates to a device for adjusting the supply amount of slurry and a method for adjusting the amount of slurry supplied from the slurry storage tank to the CMP equipment through the supply line, installed on the supply line, according to the voltage strength supplied Flow rate control means for controlling the supply amount of the slurry supplied to the CMP equipment, the control unit for supplying voltage to the flow rate control means, and supplying the voltage of different sizes to the flow rate control means to supply through the supply line for each voltage intensity It includes a multi-offset portion to compensate the voltage intensity supplied to the flow rate control means by the control unit so that the set supply amount of the slurry to be supplied to the CMP equipment by the data measured the actual supply amount of the slurry to correspond to the actual supply amount of the slurry. Therefore, the present invention is supplied to the flow rate control means corresponding to the set supply amount of the slurry to be supplied to the CMP equipment through the data measured several times the actual supply amount of the slurry supplied to the CMP equipment for each voltage intensity supplied to the flow rate control means By compensating the voltage intensity, the set supply amount of the slurry and the actual supply amount of the slurry are matched, which has the effect of stably and accurately polishing the wafer in the CMP process.