首页> 外国专利> Apparatus for applying a Slurry to a substrateThat includes a discharge Surface; a layer of Grout underpinning; Sprinkling devices adjacent to the surface Discharge; flow Recirculation devices that allow a continUo slurry; and control devices to vary the flow of slurry.

Apparatus for applying a Slurry to a substrateThat includes a discharge Surface; a layer of Grout underpinning; Sprinkling devices adjacent to the surface Discharge; flow Recirculation devices that allow a continUo slurry; and control devices to vary the flow of slurry.

机译:用于将浆料施加到基板上的设备,该设备包括排出表面;一层水泥浆支撑;洒水装置邻近地表排水;允许连续浆液流动的再循环设备;和控制装置来改变泥浆的流量。

摘要

Apparatus for applying a Slurry (i) a substrate (2). The Apparatus includes a Drum discharge (4) that incorporates a surface discharge (5) arranged to support a layer of Grout.With a roller (8) is placed in a position closely adjacent to the unloading Drum and can rotate to splash the slurry Discharge in the surface of the substrate.The control devices vary or selectively disrupt the flow of the slurry Discharge in the surface of the substrate.
机译:用于施加浆料(i)衬底(2)的设备。该设备包括一个滚筒排放装置(4),该滚筒排放装置包括一个表面排放装置(5),用于支撑一层水泥浆。滚筒(8)放置在紧靠卸料滚筒的位置,并且可以旋转以飞溅浆料控制装置改变或有选择地破坏浆液的流动。

著录项

相似文献

  • 专利
  • 外文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号