Device for e.g. lapping of semiconductor wafers, has upper disk movable between and loading operating positions and pressable in operating position against lower disk, where upper disk does not experience tilting in course of movement

摘要

The device (10) has a circular upper working disk (24) and a circular lower working disk (16) held by a carrier (32), where one of the disks is driven by a rotary drive (22) around a vertical axle. A positioning- and pressing mechanism (36) comprises a driving device through which a radial arm (38) of the mechanism is tiltable around a pivot axis (42). The upper disk is movable between a loading position and an operating position, and is pressable in the operating position against the lower disk, where the upper disk does not experience tilting in a course of movement.