Power semiconductor module, has metal foil with section connected with carrier and connecting section spaced from carrier, where metal foil is electrical-conductively connected with another metal foil at connecting section

摘要

The module has a metal foil (10) with a section (11) rigidly connected with an insulation carrier (19) of a circuit carrier (1) and a connecting section (12) spaced from the insulation carrier. Another metal foil (20) exhibits a section (21) rigidly connected with an insulation carrier (29) of another circuit carrier (2). The former metal foil is electrical-conductively connected with the latter metal foil at the connecting section. The former insulation carrier and/or the latter insulation carrier are formed as ceramic panels. The circuit carriers are designed as direct copper bonding- substrates or active metal brazing-substrates. An independent claim is also included for a method for manufacturing a power semiconductor module.