首页> 外国专利> ALXGA (1-X) AS substrate, infrared LED epitaxial wafer, infrared LED, process for making an ALXGA (1-X) AS substrate, method of making an epitaxial wafer for an infrared LED, and method of making an infrared LED

ALXGA (1-X) AS substrate, infrared LED epitaxial wafer, infrared LED, process for making an ALXGA (1-X) AS substrate, method of making an epitaxial wafer for an infrared LED, and method of making an infrared LED

机译:ALXGA(1-X)AS基板,红外LED外延晶片,红外LED,制造ALXGA(1-X)AS基板的工艺,制造用于红外LED的外延晶片的方法以及制造红外LED的方法

摘要

Affords AlxGa(1-x)As (0x1) substrates epitaxial wafers for infrared LEDs, infrared LEDs, methods of manufacturing AlxGa(1-x)As substrates, methods of manufacturing epitaxial wafers for infrared LEDs, and methods of manufacturing infrared LEDs, whereby a high level of transmissivity is maintained, and through which, in the fabrication of semiconductor devices, the devices prove to have superior light output characteristics. An AlxGa(1-x)As substrate (10a) as disclosed is an AlxGa(1-x)As substrate (10a) furnished with an AlxGa(1-x)As layer (11) having a major surface (11a) and, on the reverse side from the major surface (11a), a rear face (11b), and is characterized in that in the AlxGa(1-x)As layer (11), the amount fraction x of Al in the rear face (11b) is greater the amount fraction x of Al in the major surface (11a). The AlxGa(1-x)As substrate (10a) may additionally be provided with a GaAs substrate (13), contacting the rear face (11b) of the AlxGa(1-x)As layer (11).
机译:用于红外LED的Affords AlxGa(1-x)As(0x1)衬底外延晶片,红外LED,制造AlxGa(1-x)As衬底的方法,制造用于红外LED的外延晶片的方法以及制造红外LED的方法维持了高水平的透射率,并且通过这种透射率,在半导体器件的制造中,器件被证明具有优异的光输出特性。公开的AlxGa(1-x)As衬底(10a)是AlxGa(1-x)As衬底(10a),其配备有具有主表面(11a)的AlxGa(1-x)As层(11),并且,在与主表面(11a)相反的一侧是背面(11b),其特征在于,在AlxGa(1-x)As层(11)中,背面(11b)中的Al的量分率x )越大,主表面(11a)中的Al的含量分数x越大。 AlxGa(1-x)As衬底(10a)可以另外设有与AlxGa(1-x)As层(11)的背面(11b)接触的GaAs衬底(13)。

著录项

  • 公开/公告号DE112009001297T5

    专利类型

  • 公开/公告日2011-04-07

    原文格式PDF

  • 申请/专利权人 SUMITOMO ELECTRIC INDUSTRIES LTD.;

    申请/专利号DE112009001297T5

  • 发明设计人

    申请日2009-05-27

  • 分类号C30B29/42;C30B19/12;H01L21/205;H01L33;

  • 国家 DE

  • 入库时间 2022-08-21 17:47:31

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