首页> 外文会议>Conference on infrared technology and applications XXXV >Silicon germanium oxide (Si_xGe_(1-x)O_y) infrared material for uncooled infrared detection
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Silicon germanium oxide (Si_xGe_(1-x)O_y) infrared material for uncooled infrared detection

机译:硅锗氧化物(Si_xGe_(1-x)O_y)红外材料用于非制冷红外检测

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Thin film Si_xGe_(1-x)O_y infrared sensitive material was grown by RF magnetron sputtering, by depositing Si and Ge thin film simultaneously from two deposition targets in an oxygen (O) and argon environment at room temperature and at 400°C. Film composition was varied by adjusting RF power applied to the silicon target and by varying the oxygen flow of the gas mixture in the deposition chamber. The atomic compositions of Si, Ge, and O in the deposited thin film were determined and analyzed using energy dispersive X-ray spectroscopy (EDS). The influence of changing Ge and Si and O compositions on temperature coefficient of resistance (TCR), and resistivity were studied. Different fabrication scenarios have been used to vary the Ge, Si and O concentrations. The highest achieved TCRs and the corresponding resistivities at room temperature were -4.86 %/K and -6.43 %/K, and 2.45×10~2 Ω cm and 3.34×10~2 Ω cm using Si_(0.195)Ge_(0.706)O_(0.099)and Si_(0.127)Ge_(0.835)O_(0.038) for films deposited at room temperature and at 400 °C, respectively.
机译:通过在室温(400)和氧气(O)和氩气环境中同时从两个沉积靶上沉积Si和Ge薄膜,通过RF磁控溅射法生长薄膜Si_xGe_(1-x)O_y红外敏感材料。通过调节施加到硅靶上的射频功率和通过改变沉积室中气体混合物的氧气流量来改变膜的组成。使用能量色散X射线光谱法(EDS)确定并分析了沉积薄膜中Si,Ge和O的原子组成。研究了Ge,Si和O组成的变化对电阻温度系数(TCR)和电阻率的影响。已使用不同的制造方案来改变Ge,Si和O的浓度。使用Si_(0.195)Ge_(0.706)O_,在室温下获得的最高TCR和相应的电阻率分别为-4.86%/ K和-6.43%/ K,以及2.45×10〜2Ωcm和3.34×10〜2Ωcm。 (0.099)和(Si_(0.127)Ge_(0.835)O_(0.038)分别用于在室温和400°C下沉积的薄膜。

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