Device for measuring thickness of e.g. wafer, has measuring unit arranged on side of another measuring unit, and evaluating device for associating measured values of measuring units to compute thickness of part to be measured

摘要

The device (10) has a measuring unit (23) for measuring space between a measuring head of the measuring unit and a surface area of a part (1) turned towards the measuring unit. Another measuring unit (24) is arranged on a side of the former measuring unit for measuring space between a measuring head (26) of the latter measuring unit and a surface area of the part turned towards the latter measuring unit. The latter measuring unit is connected with an evaluating device, where the evaluating device associates measured values of the measuring units for computing thickness of the part.