Method for processing disk-shaped semiconductor wafer, involves forming circular opening on rear side of wafer, surrounding circular opening by ring shaped reinforcement sections with two beveled surface area

摘要

The method involves driving a rotary shaft perpendicular to a grinding surface, and lowering a grinding wheel to connect the grinding surface with a rear side (11b) of a wafer (11) that is held on a clamping table. The clamping table is rotated, and the grinding wheel is loaded. The rear side of the wafer is grinded in an area to same depth as a lower end of a ring shaped groove for forming conical ring shaped reinforcement sections, so that a circular opening is formed on the rear side of the wafer and surrounded by the ring shaped reinforcement sections with two beveled surface area.