首页> 外文OA文献 >Dynamics of moisture interactions with wafer and reactor surfaces during semiconductor processing

【2h】

Dynamics of moisture interactions with wafer and reactor surfaces during semiconductor processing

机译：半导体加工过程中水分与晶片和反应器表面相互作用的动力学

代理获取

本网站仅为用户提供外文OA文献查询和代理获取服务，本网站没有原文。下单后我们将采用程序或人工为您竭诚获取高质量的原文，但由于OA文献来源多样且变更频繁，仍可能出现获取不到、文献不完整或与标题不符等情况，如果获取不到我们将提供退款服务。请知悉。

页面导航

著录项
引文网络
相似文献
相关主题

著录项

作者
Shero Eric James 1969-;
展开▼
作者单位

展开▼
年度 1998
总页数
原文格式 PDF
正文语种
中图分类

相似文献

外文文献
中文文献
专利

1. Computer modeling of surface interactions and contaminant transport in microstructures during the rinsing of patterned semiconductor wafers [J] . M.R. Dodge, F. Shadman Computers & Chemical Engineering . 2014,第sepa4期

机译：漂洗图案化半导体晶圆期间微结构中表面相互作用和污染物传输的计算机建模
2. An optoelectronic notch ('dip') phenomenon in the heterodyne photocarrier radiometry frequency response of Si wafers: a route to quantitative trap-state dynamic processes in semiconductors [J] . Song Yaqin, Mandelis Andreas, Melnikov Alexander, Semiconductor science and technology . 2020,第11期

机译：Si晶片外差光载体放射频率响应中的光电缺口（'DIP'）现象：半导体中定量陷阱状态动态过程的路径
3. Soil moisture-precipitation coupling over Central Europe: Interactions between surface anomalies at different scales and the dynamical implication [J] . Baur Florian, Keil Christian, Craig George C. Quarterly Journal of the Royal Meteorological Society . 2018,第717aPta2期

机译：中欧土壤湿度降水耦合：不同尺度的表面异常之间的相互作用和动力学意义
4. Multicomponent interactions of moisture and organic impurities with the wafer surface [C] . M. Verghese, E. Shero, F. Shadman, Symposium on electrochemical processing in ULSI fabrication I . 1999

机译：用晶片表面的水分和有机杂质的多组分相互作用
5. Gas-surface dynamics and charging effects during plasma processing of semiconductors [D] . Hwang, Gyeong Soon 1999

机译：半导体等离子体处理过程中的气体表面动力学和电荷效应
6. Thermodynamics of interactions of urea and guanidinium salts with protein surface: Relationship between solute effects on protein processes and changes in water-accessible surface area [O] . Elizabeth S. Courtenay, Michael W. Capp, M. Thomas Record JR. 2001

机译：尿素和胍盐与蛋白质表面相互作用的热力学：溶质对蛋白质过程的影响与水可及表面积变化之间的关系
7. Surface Finishing Technology and Semiconductor Fabrication Process. Drying Technology for Silicon Wafer in Semiconductor Manufacturing. [O] . Cozy BAN, Kazunao SATO 1998

机译：表面精加工技术和半导体制造工艺。半导体制造中硅晶片的干燥技术。
8. Theory of the Interaction of Laser Radiation with Molecular Dynamical Processes Occurring at a Solid Surface [R] . George, T. F., Lin, J., Lam, K. S., 1979

机译：激光辐射与固体表面分子动力学过程相互作用的理论

Dynamics of moisture interactions with wafer and reactor surfaces during semiconductor processing

著录项

引文网络

相似文献

相关主题

期刊订阅